EUREKA PROJECT > 3830 EURIPIDES
- SUMMARY
- OUTLINE
- PARTICIPANTS
-
FRANCE
-
CZECH REPUBLIC
-
FRANCE
-
FRANCE
-
GERMANY
-
GERMANY
-
NORWAY
-
FRANCE
-
SPAIN
-
ITALY
-
FRANCE
-
FRANCE
-
DENMARK
-
FRANCE
-
GERMANY
-
FRANCE
-
GERMANY
-
FRANCE
-
FRANCE
-
ISRAEL
-
NORWAY
-
GERMANY
-
EUREKA INITIATIVE FOR PACKAGING AND INTEGRATION OF MICRO-DEVICES AND SMART SYSTEMS
TO DEVELOP NEW PRODUCTS BASED ON MINIATURISATION, AUTONOMY, RELIABILITY, HIGH SPEED AND LOW ENERGY, USING MICRO AND NANOTECHNOLOGIES BY ADDRESSING HETEROGENOUS TECHNOLOGIES FOR AMBIENT INTELLIGENT VISION. THIS CLUSTER IS THE FOLLOW-UP OF EURIMUS II AND PIDEA+.
Project Description
VISION/SMART SYSTEM INTEGRATION: System integration technologies have increasingly become a vital factor in the economic success of suppliers and users especially in the areas of consumer electronics, telecommunications, aeronautics and the automotive industry. Faced with the rapid development of IC technology, the traditional packaging is changing into a complex system integration technique to satisfy the growing demand in terms of increased functionality, performance and miniaturisation of electronic systems. Communication, computing and security are the backbone of the so-called information society. Electronic systems are used in a large variety of applications. New applications are arising in the field of health monitoring, security, lighting, etc. New applications require systems with integrated electrical and non-electrical (sensor-, actuator-) functions. These Heterogeneous Systems or Smart Systems have to create adequate interfaces for the different application environments. The functionality of such systems can be considerably enlarged by the integration of mechanical, optical and/or biological functions. The realisation of such Smart Systems is based on new architectures, components and system integration technologies as well. Therefore the progress in micro and nano-electronics, micro-system technologies, bioelectronics and photonics are important factors. So far Smart System Integration has become a strategic enabler for the entire economy. The integration of highly complex Smart Systems has to be carried out more cost efficiently, with a high degree of miniaturisation and flexibility in adaptation to different applications. Using new integration techniques, Smart System Integration will be able to use different technologies to integrate devices for sensing, electrical signal and data processing, wireless communication, power conversion and storage. With respect to non-electrical functions, Smart System Integration achieves higher complexity compared to System on Chip solutions. The heterogeneous integration concept is also gaining importance due to the lower cost and risk assessment compared to System on Chip (SoC) which is a solution designed more for mass production. Further advantages of Smart System Integration solutions include their shorter time to market cycle and a high degree of flexibility. The high flexibility of Smart System Integration offers the possibility of integrating System on Chip solutions for subsystems. The key attributes of Smart System Integration can be summarised as: - system partitioning/modularisation - chip-package co-design (on-chip, off-chip) - integration of electrical and non-electrical components - integration of different functions in one module/package - application of 'add on' technologies to increase system functionality - high density of component integration - integrated power conversion and storage - integrated wireless communication - short time to market cycles - possibility of low volume production - low cost solution. The advantage of the European industry and research institutions is seen in the development and production of smart products and systems designed and produced by optimised technologies with high flexibility and a short time to market cycle. This requires the fast and efficient development of new System Integration Technologies. The development of new system architectures, design procedures, materials, technologies, equipment, test procedures and quality management under sustainability aspects exceeds the possibilities of single companies or local industrial networks. This potential for the leading European equipment, microelectronic and micro-system manufacturers as well as leading research institutes, is strongly endorsed as an efficient common initiative for Smart System Integration in supporting future product developments in Europe.
Technological Development Envisaged
Smart System Integration aspects raise new technological challenges. A major challenge is the evolution towards heterogeneous integration, namely to integrate the multitude of different components using different technologies and materials. The link between application and technology has to be tightened. The system's approach requires integrated design and manufacturing and has to bring together interdisciplinary technological approaches and solutions. New integration technologies are fast evolving in response to the market demand for smaller, thinner and lighter products for the rapidly expanding market. The accelerated pace of innovation has resulted in the development of several new technologies. Wireless and mixed signal devices, bio-chips, optoelectronics and MEMS (Micro-Electro Mechanical System) have placed new requirements on system integration technologies. The rapid adoption of these new elements in the expanding electronics market has been a strong driver of innovations such as Systems in a Package (SIP), Wafer Level Packaging (WLP) and 3 Dimensional Integration. Wafer Level Packaging for example might be considered as the minimalist package where the packaging's added-value is achieved through wafer level processing. System in Package, on the other hand, might be considered as the minimalist system when the system packaging is achieved in die packaging. New architectures include printable circuits, thinned wafers and both active and passive embedded devices. They are emerging as solutions that meet market requirements. The materials and equipment used in assembly and packaging are also changing rapidly to meet requirements and environmental regulations of these new architectures. Similarly, Optoelectronics, RF (Radio Frequency) and Mixed Signal, and MEMS devices, each represent departures from CMOS (Complementary Metal-Oxide Silicon) device technologies, in order to serve new market applications. Their advancements will demand specific sets of packaging technology requirements for their future applications. For applications in the automotive field, for example, important criteria will be stringent requirements with regard to harsh environmental conditions, elevated operating temperatures, high power density and high reliability. Applications in the telecommunications field, however, will be characterised by high functionality combined with a high degree of miniaturisation. They require wireless signal transmission and, in addition to electrical transmission, optical signal transmission. Bio-compatibility of the system and integration of appropriate sensors will be important criteria in medical applications. In the future, the technologies expected are those that exploit unique nanometre scale phenomena integrated into micro-scales and macro-systems, providing integrated systems with unprecedented functionality and performance. To achieve this, a number of issues must be addressed e.g. coupling molecular level structures and devices to larger scale platforms and devices, and combining 'top-down' and 'bottom-up' assembly in order to create new classes of functional materials or to manufacture an integrated system.
Main contactEURIPIDES BUREAU Organisation type > SME |
Contribution to project
Mainly in charge of communication.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactBIC OSTRAVA S.R.O.
DIPL.-ING. MAREK VALDMANN > Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council. Partner in DIALOG.
Expertise
System integration.
Main contactFRAUNHOFER INSTITUTE IZM - INSTITUT F. ZUVERLAESSIGKEIT UND MIKROINTEGRATION MR. JUERGEN WOLF > DIRECTOR'S PERSONAL ASSISTANT Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactMEMSCAP MR. GAETAN MENOZZI > VICE PRESIDENT STRATEGY Organisation type > SME |
Contribution to project
Chairman of the EURIMUS II Board. Candidate for Chairman of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactATMEL GRENOBLE
MR. PHILIPPE ROMMEVEAUX > BUSINESS DEVELOPMENT MANAGER Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactVTI TECHNOLOGIES OY MR. HANNU LAATIKAINEN > VICE PRESIDENT, SALES AND MARKETING Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactFRAUNHOFER INSTITUTE IZM DR. KLAUS DIETER LANG > DIRECTOR Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project EMC-PACK. - Other projects are planned in the area of Advanced Packaging and Substrate Technologies.
Expertise
The Institute (FhG-IZM) in Berlin researches and develops methods and technologies for the packaging and interconnection of microelectronic, micro/opto-mechanical components and micro-systems.
Main contactSENSONOR AS MR. PER GERHARD GLOERSEN > R & D COORDINATOR Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
- Development and manufacturing of sensors and micro-systems for automotive applications. - Worldwide market leader for tyre pressure sensors.
Main contactTEMEX MICROSONICS MR. PATRICK DRUENNE > RESPONSABLE COMMERCIAL http://www.marc.solal@temex.fr Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council. Active in RF and microwave integration projects.
Expertise
- Materials - Component process.
Main contactCOPRECI, S. COOP.
MR. JAVIER ARANCETA > R & D DIRECTOR Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactFIAT RESEARCH CENTRE MR. PIERO PERLO > DIRECTOR Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactCEA GRENOBLE - LABORATOIRE D'ELECTRONIQUE DE TECHNOLOGIE ET DES TECHNOLOGIES DE L'INFORMATIQUE MR. GILLES POUPON > PROGRAM MANAGER Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
-
Main contactTHALES SYSTEMES AEROPORTES S.A. MR. PHILIPPE KERTESZ > http://www.thalesgroup.com/airbornesystems Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project HIFAP / MICROSOM.
Expertise
Microelectronics - optics system.
Main contactST MICROELECTRONICSS MR. JEAN-LUC MORAND > STRATEGIC PLANNING DIRECTOR Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project WALPACK.
Expertise
-
Main contactSONIONMEMS - CAT/DTU MR. UDO KLEIN > OPERATIONS MANAGER Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactMARTEC MR. LAURENT BARATIER > DIRECTION DES AFFAIES MILITAIRES ET DES ADMIN CIVILES Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project VISIOPACK – LOC KANNAD – KEENATON – DIALOGS – HIT HOT.
Expertise
-
Main contactCONTINENTAL AUTOMOTIVE SYSTEMS MR. HORST KORNEMANN > DIRECTOR PUBLIC PRIVATE PARTNERSHIP http://www.cont-online.com // www.contiteves.com // www.temic.com Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Supplier to the worldwide automotive industry with expertise in safety, stability and comfort of driving in passenger cars. Large supplier of brake systems, both conventional and electronic (ESP, ABS-Automatic Breaking System), and microelectronics controllers and sensors in various applications: power train and chassis, body control, passenger safety, comfort, driver assistance systems, starter-generator-systems, cooling fan modules and electric motors.
Main contact3D PLUS
MR. CHRISTIAN VAL > CHIEF EXECUTIVE Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled projects WALPACK / MAJE / ADS / ACCVUS.
Expertise
-
Main contactVTT/ELECTRONIC CIRCUITS AND SYSTEMS
TECHNICAL RESEARCH CENTRE OF FINLAND MR. JAAKKO LENKKERI > RESEARCH PROFESSOR http://www.virtual.vtt.fi/indexe.htm Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Microelectronics - substrates.
Main contactADIXEN (ALCATEL VACUUM TECHNOLOGY) MR. ROLAND BERNARD > DIRECTOR ADVANCED SYSTEMS AND BUSINESS DEVELOPMENT Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactVIA ELECTRONIC
MR. FRANZ BECHTOLD > MANAGING DIRECTOR Organisation type > SME |
Contribution to project
Member of the EURIPIDES Council. Project contributions, dissemination and communication.
Expertise
- Advanced Interconnection and Packaging Technology, - Ceramid, - LTCC (Low Temperature Co-fired Ceramic), - Thickfilm, - Microsystems, - Sensors Project coordination and management, - Moderation of technical sessions.
Main contactINTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM V.Z.W. (IMEC)
PROF. ANDRE VAN CALSTER > Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactCSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE S.A.
MR. ANDRE PERRET > VICE PRESIDENT STRATEGIC RELATIONS Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Applied research, development and industrialisation in micro-nanotechnologies and system engineering.
Main contactEADS SECURE NETWORKS MR. HERVE MOKRANI > HEAD OF RESEARCH & TECHNOLOGY PROJECTS SUB-DEPARTMENT Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactEURIPIDES OFFICE MR. YVES LE GOFF > OFFICE DIRECTOR Organisation type > SME |
Contribution to project
Operations manager of EURIPIDES.
Expertise
Development and manufacturing of sensors and micro-systems for automotive applications.
Main contactSELEX SISTEMI INTEGRATI S.P.A. DR. MAURO VARASI > RADAR AND TECHNOLOGY/OPERATION DIVISION Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project HIFAP.
Expertise
Microelectronics - optics system.
Main contactTOWER SEMICONDUCTOR LTD. MR. RAFI NAVE > CHIEF TECHNOLOGY OFFICER Organisation type > Large company |
Contribution to project
Candidate for the EURIPIDES Council.
Expertise
VLSI (Very Large Scale Integration), Semiconductor Design and Manufacturing.
Main contactPHILIPS AUSTRIA GMBH - AUDIO VIDEO INNOVATION CENTRE DR. KLAUS PAVLIK > R & D COORDINATOR Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council. - partner in the labelled project SMART PACK.
Expertise
-
Main contactSINTEF ICT DR. ANDERS HANNEBORG > RESEARCH DIRECTOR http://www.sintef.no // www.sintef.no/microsystems Organisation type > Research Institute |
Contribution to project
Member of the EURIPIDES Council.
Expertise
Development, design and fabrication of silicon based micro-system devices and silicon radiation detectors.
Main contactINFINEON TECHNOLOGIES AG
MR. KLAUS PRESSEL > DEPARTMENT CAT AIT TI Organisation type > Large company |
Contribution to project
Member of the EURIPIDES Council. - Partner in the labelled project EMCPACK / FULL CONTROL.
Expertise
-