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New generation of 3d integrated passive components & microsystems in ltcc (low temperature co-fired ceramic) technology

To comprise research, development, fabrication and characterisation of new generations of miniaturised passive components (inductors, transformers), sensors (pressure, temperature) as well as microsystems for life science applications using the advanced ltcc technology.

This project is intended to comprise research, development, fabrication and characterisation of new generations of miniaturised passive components (inductors, transformers), sensors (e.g. pressure sensors, temperature sensors, etc.) as well as micro-systems for life science applications using the advanced LTCC (low-temperature co-fired ceramics) technology. The Project will focus on the following main activities: - Design of novel multilayer 3D passive components (inductors and transformers) intended for implementation in the RF (radio-frequency) range and their fabrication in LTCC technology; - Design, modelling, optimisation and fabrication of novel integrated passive components (inductors+transformers) for power electronic applications; - Improved realisations of different structures of wireless pressure sensors; - Development of new dielectric and ferrite materials with improved characteristics for application in LTCC technology; - Micro-fluidic devices for fast mixing and reaction analysis; - Integrated micro-systems for sampling, imaging and analysis of circulating cells in body fluids; and - Realisation of temperature sensitive thick-film resistors within LTCC micro-systems either as temperature sensors or as a part of temperature compensation circuits. These activities aim to create new products allocated to domestic and foreign industries as well as to provide basic knowledge on fabrication procedures and processes for custom-made components and micro-systems. The LTCC technology is defined as a way to produce multilayer components and devices with the help of single tapes, which are laminated together and fired in only one step. This improves performance, saves time and money due to rapid prototyping of complex structured systems, and reduces component dimensions. This technology also enables implementation of the integrated passive components (IPCs) concept and multi-chip module (MCM) concept. IPC involves manufacturing the passives as a group in or on a common substrate instead of in their own individual packages, while MCM offers integration of a number of active and passive components in a single module. As the amount of passive components (inductors, transformers, capacitors, resistors or varistors) used in IPSs and MCMs increases continuously in electronic subsystems present on today’s market, optimisation of their size and behaviour is vital for the improvement of their performance. The focus of this project is directed at the design of the new layouts of optimised three-dimensional LTCC-based inductors and transformers for usage in high-frequency applications. The second focus aims to implement micro-fluidic components and to integrate active and passive modules to obtain micro-systems for advanced medical applications. Additionally, LTCC-based integrated transformers+inductors intended for power applications (in integrated power converters) using improved dielectric and/or ferrite materials will also be designed, fabricated and tested. All structures will be developed with the aim of improving their performances and reducing the occupied chip area. Specific aims are the development, fabrication and characterisation of advanced pressure and flow sensors for various applications. The purpose of this project is to promote close cooperation among participating institutions and companies in this field and the introduction of the LTCC-based 3D integrated inductors and transformers for RF and power applications, pressure sensors and integrated micro-fluidic systems to the markets. Increasing market and profit share in existing markets, entering new marketplaces and increasing benefits in the RF electronics, power electronics, electronic material and integrated systems development worldwide are objective targets. As the innovative approach is directed towards reducing size and costs while improving performance of existing components and systems, the participants will benefit due to a significant increase of their competitive capacity. The participants in the consortium cover a broad range of expertise and experience required to successfully perform the planned activities within the project. Moreover, most of them have already worked together on previous research projects and the overall consortium has great experience in EC projects. The consortium has been created with the intent of synergistically combining complementary scientific and infrastructure expertise. Long-standing experience in the field of interest, will assure with high probability a successful development of innovative products according to the needs of participants from industry.
Project ID: 
4 570
Start date: 
01-07-2009
Project Duration: 
36months
Project costs: 
1 590 000.00€
Technological Area: 
Electronics, Microelectronics
Market Area: 
Electronic Components

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