MENU

Integrated multiphase datacenter cooling

Joint development of an integrated multiphase datacenter cooling solution based on the principle of latent heat of vaporization combining the benefits of direct chip multiphase and rack liquid cooling.

The partners propose to jointly develop a fully integrated direct contact multiphase cooling solution for 2U and 4U servers. The multiphase technology will be used to effectively absorb the heat at the heat source (chip(s)) and move it quickly to the back of the server. In a secondary step, a liquid cooled loop will collect the heat and move it outside of the building where the heat will be rejected to ambient. The technical objective is to design a hermetic system with a non-conductive working fluid based on the principle of latent heat of vaporization - with a back of the server hand-off to an integrated liquid cooling loop. The project will be split into 6 milestones which can be summarized as follows: 1. Multi CPU/ Evaporator Design This will include load balancing, CFD analysis and development of a customized joining approach to connect various evaporators to the condensing unit(s) via proprietary joining methods. 2. Multiphase/ Liquid Hybrid Heat Exchanger Design (hermetic) Overall system pressure analysis, development and design (CAD) and production of 1st prototype for an initial performance and boiling behavior analysis. 3. Custom Explosion Welded Clad Determining of the best functional layers for the underlying application, evaluation of interlayers (compatibility versus performance versus cost). Build of a first prototype & in-depth performance and quality evaluation. 4. Performance Optimization Critical heat flux (CHF), surface super heat (SSH) and boiling onset will be evaluated and optimized. 5. Component, Product and Life-cycle Testing Piece part analysis process (PPAP), accelerated life-cycle testing and failure mode and effects analysis (FMEA) will be conducted on a component level. The integrity of the components and unit regarding hermeticity will be evaluated. 6. First Full Prototype Selection of hardware and integration of the multiphase cooling technology into the server and liquid cooling technology on a rack level will be implemented. The operating behavior will be studied in depth under different loads including idle temperatures. A full TCO analysis, PPAP, FMEA as well as an accelerated life-cycle test will be carried out on a unit level.
Acronym: 
EUREKA CAP CAN/ITALY
Project ID: 
9 565
Start date: 
01-06-2014
Project Duration: 
18months
Project costs: 
190 000.00€
Technological Area: 
ELECTRONICS, IT AND TELECOMS TECHNOLOGY
Market Area: 
COMPUTER RELATED

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.