Eddema will increase product density of the electronics board miniaturization, assess embedded die technology in term of manufacturing and reliability and define design methodology compliant with automotive constraints including thermal, emc, mechanical simulations and layout methods & tools using 3d ecad...
bob will develop and validate an innovative solution for realization of high-density boards beyond the smd limits found, remaining reliable and reparable. A part of each new construction is also mechanical and thermomechanical reliability. Vibrations and shocks cause some tens of percent of the mechanical failures in...
Optimization of long-haul-bus-terminals through a terminal slot management and information system
BIM based Cyber-physical System for Bridge Assessment
Extending DRBD for Large Scale Cloud Deployments
Develop a system to make welders certicates more effective and improve distribution and access to the certificates through the internet. Also including information about the european welding federation education scheme.
Development of a central system for rail freight transport based on a concentration of information, web applications and demands from different applications operated out of the portal, to serve users as the information source, guide and navigator.
To develop new products based on miniaturisation, autonomy, reliability, high speed and low energy, using micro and nanotechnologies by addressing heterogenous technologies for ambient intelligent vision. This cluster is the follow-up of eurimus ii and pidea+.
The project is aimed for applied research and development for intelligent building automation with technology of wireless sensor networks operating under ieee 802.15.4 standard. Wireless communication system will be integrated into the existing bus system inels.