Development of the first lightweight car, fully made of composite parts and 100% recyclable
Flexible communication network in the field of industrial production systems integrated in company operations to develop competitiveness in mfg. Methods/design, mfg.Systems/ technology and organisation/human resource development.
Will support further development of abatement strategies within europe by providing an improved scientific basis for the quantification of source-receptor relationships for photo-oxidants and acidifying substances.
Cooperative r & d initiative defined to develop and exploit the strengths of the european packaging and interconnection industries in information & communication technology systems (icts) transport and component manufacturing processes.
Collaborative industrial r&d programme dedicated to "software for software-intensive systems" that is being developed by the european information technology producers and users' industry to boost european competitiveness.
The objective of this strategic project is to apply new biotechnological tools and agronomic technologies to improve the european forestry sector.
Pidea+ is a cluster programme whose objectives are to develop new electronic packaging and interconnection technologies for miniaturisation in order to enhance the european electronics industry. It follows pidea (e!1888 - 09/98-03/04).
There are two main challenges: 1. To become sustainable by reducing resource consumption, managing transport and utility networks in a sustainable way, reducing environmental and man-made impacts, improving safety and security and protecting cultural heritage; 2. To become a demand-driven sector.
To develop new products based on miniaturisation, autonomy, reliability, high speed and low energy, using micro and nanotechnologies by addressing heterogenous technologies for ambient intelligent vision. This cluster is the follow-up of eurimus ii and pidea+.
Euripides2 will cover the electronic systems integration value chain, from materials, equipment and technologies, through components, modules, up to embedded, mechatronics, enmeshed and implanted systems.