Pamiaq aims at the development of a new kind of particle matter sensor suitable for applications in mass markets for pm10 and pm2.5 detection. Innovative heterointegration is planned to realise on-chip integration of ic, mems, 3d microfluidics. The markets of indoor air quality residential and office buildings,...
Eddema will increase product density of the electronics board miniaturization, assess embedded die technology in term of manufacturing and reliability and define design methodology compliant with automotive constraints including thermal, emc, mechanical simulations and layout methods & tools using 3d ecad...
Icape will design, test and evaluate according to both space and high power electronics environments, the next generation of metal matrix composite materials and 3d architectures, with goals of lighter weight, higher robustness, higher functionality, lower cost “by design”, and higher thermal and mechanical...
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The main goal of flexilvia is to develop flexible rfid inlays and associated reel-to-reel processes compatible with a high volume production. The rfid inlays are made of flexible substrates on which small silicon chips are assembled by flip-chip. This project therefore aims at designing, manufacturing and packaging...
Ceramjet has the goal to offer to the main actors of the ceramic interconnect and component makers of europe a dramatic competitive advantage by using a revolutionary method for making their products. The ceramjet targeted direct and immediate applications are: mlccs (capacitors), fine line thick film circuitry, ltcc...