Mobile robot development, industrialisation and sale for tele-surveillance purposes
Submicron silicon process technology, manufacturing and design capability by 1995. Technical targets: very high complexity (10-100,000,000 transistors/chip); very high speed integrated circuits (5 gbit/s).
The overall objective is to provide the european structural steelwork industry with the means to overhaul itself by introducing purpose-developed, computer integrated manufacturing (cim) systems.
Specify and develop hardware and software systems that permit very short lead times between design and manufacture of metal aircraft parts
New process for the preparation of pharmaceutical products of fermentation, based on new mineral membranes characterised by their separating capacity adjusted to each stage of the process
Design and development of high bit-rate systems for transmission of telecommunication signals on trunk and local networks, to support the implementation of the future broad band integrated service digital network (b-isdn or ibcn).
High power laser facilities installation with beam manipulation/work handling equipment and high power laser instrumentation and beam diagnostic equipment. Setting up a european laser co2 network.
Flexible automated assembly systems for local integration of information and material flow, cim and jit (just-in-time) advanced hardware and software modules, assembly equipment and advanced systems to improve product process control.
New automated assembly lines for large series of small and medium-sized products. The first applications will be low voltage mini-switches.
This process consists of the hardening of initially unconsolidated materials from chemical and physio-chemical reactions resulting from diagenesis and lateritisation