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Eureka projects

Restles will integrate serial technologies like silicon mems, wafer thinning, chip stacking and flip chip to one unique packaged chip stack at die scale (pcsds). The inherent cross influence of the different materials on device performance and intelligent control mechanisms to eliminate these parasitic effects will be...

Cosy 3d will create an innovative, highly secure and portable intelligent system, that will facilitate, advanced telephony, multimedia, secure transactions, enterprise access (digital & physical). Technology building blocks will be developed in order to build the next generation of micro-modules for secure sim and...

The main goal of iq fuel is to develop a novel system approach comprising of a miniaturized and cost optimized sensor device and the associated engine management system functionalities, which using the output signals of the sensor device will allow to adapt the engine control strategies and parameters in function of...

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.