European collaboration in the field of flexible automated assembly systems
Submicron silicon process technology, manufacturing and design capability by 1995. Technical targets: very high complexity (10-100,000,000 transistors/chip); very high speed integrated circuits (5 gbit/s).
Design of excimer laser test facilities to investigate reliability of components for multi-kilowatt industrial excimer laser. Create european network of component and system subcontractors.
Knowledge and data acquisition in areas of welding engineering and derivation of pc expert systems with derivation of expert system modules and integration to form form welding engineering information system.
Objective: the aim is to generate sub-projects developing high technology products, processes, systems or services contributing to solving some of europe's major environmental problems.
System of radio-determination by satellites with european coverage
Conduct original research in the field of electromagnetic compatibility (emc) and associated hazards relevant to civil aviation needs.
Evaluation and extension of competing technologies for high performance interconnections/packaging, principally multi-chip modules required by very large scale integration (vsli) chips, and cad tools to bridge existing packages.
The aim of the project is to produce a practical code for civil/structural design, utilising polymeric composites and involving the assembly of component products, with the ultimate aim of providing the foundation for a eurocode.
Definition and description of fire phenomena in tunnels for rail and road traffic, in conjunction with variations of tunnel geometry, ventilation conditions as well as quantity and configuration of fire load