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Flexible inlays in large volume for identification application

The main goal of flexilvia is to develop flexible rfid inlays and associated reel-to-reel processes compatible with a high volume production. The rfid inlays are made of flexible substrates on which small silicon chips are assembled by flip-chip. This project therefore aims at designing, manufacturing and packaging flexible antennae to be used in contactless object identification and tracking systems exploiting radio frequency identification technologies at short to medium distances.

Start date: 
01-07-2007
Project Duration: 
23months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.