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Thermally insulating mram interconnects

Timi will develop a new interconnect technology to be used in above-ic technologies requiring precise heat management. This technology will first be implemented into thermally-assisted mram memories.

Start date: 
03-09-2006
Project Duration: 
37months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Other electronics related equipment

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.