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Moulded interconnect device applied to smart systems

Midass targets the development of new technological solutions for the realization of innovative plastic components and interconnections for high frequency mobile and embedded applications such as communications, aeronautics, automotive…

Start date: 
02-01-2008
Project Duration: 
35months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.