MENU

3d integration of chips using embedding technologies

3dice project targets the development of technological bricks for embedding dice into organic or silicon substrates, with single or multi layer configurations, in order to perform unprecedented smart system integration at wafer level for industrial high volume manufacturing (telecom and smart cards applications).

Start date: 
01-10-2009
Project Duration: 
48months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.