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Sic rectifier bridge assembly for aeronautics compatible with high temperature harsh environments

Sicrateswill to develop new assembly processes compatible with sic components in order to propose demonstrators compatible with high temperature (junction temperature of 300°c, ambient temperature of 200°c) and large delta t (-65°c to 250°c) environments. The ultimate goal is to propose assembly and packaging solutions to support high temperature applications for aeronautics but also for automotive and industrial applications where sic devices are intended to be used.

Start date: 
01-09-2013
Project Duration: 
41months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.