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Smart analysis methods for 3d integration in advanced microsystems and corresponding materials

Sam3 project will improve the capability of the semiconductor and system suppliers to avoid defects and failures during product development based on better material understanding. The results of material characterization, failure analysis and reliability testing provide the basis for direct improvement of technological process steps during system development and device manufacturing and thus also reducing field returns.

Start date: 
01-10-2015
Project Duration: 
39months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.