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Embedded die design environment & methodology for automotive applications

Eddema will increase product density of the electronics board miniaturization, assess embedded die technology in term of manufacturing and reliability and define design methodology compliant with automotive constraints including thermal, emc, mechanical simulations and layout methods & tools using 3d ecad environment.

Start date: 
30-09-2015
Project Duration: 
35months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Other Transportation

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.