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Innovative composites and architectures for power electronics packaging

Icape will design, test and evaluate according to both space and high power electronics environments, the next generation of metal matrix composite materials and 3d architectures, with goals of lighter weight, higher robustness, higher functionality, lower cost “by design”, and higher thermal and mechanical compliances for high power electronic modules packages & structures

Start date: 
01-06-2017
Project Duration: 
24months
Technological Area: 
Electronic circuits, components and equipment
Market Area: 
Electronic Components

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.