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Automatic design and production of custom chips using direct printing on silicon wafers

The use of software and printing technology to minimise
efforts required for custom made chip production

The aim of the project is to offer a new service to the market which will enable engineers designing electronic systems to carry out electronic operations on the basis of custom chips defined using specialised software (silicon compilers); these chips are to be manufactured in a semi-conductor factory organised in such a way as to minimize the production cycle time by means of direct printing on silicon wafers. It is aimed to supply the chips in under 2 weeks.
Acronym: 
ES2
Project ID: 
16
Start date: 
01-06-1986
Project Duration: 
36months
Project costs: 
84 300 000.00€
Technological Area: 
Market Area: 

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.