Packaging and interconnection development for european applications.

Cooperative r & d initiative defined to develop and exploit
the strengths of the european packaging and interconnection
industries in information & communication technology systems
(icts) transport and component manufacturing processes.

Interconnection can be defined as all the techniques for connecting components or sub-assemblies in order to achieve one or several electronic functions. These electronic functions integrate dedicated or standard active, passive and electromechanical components, acting together or separately. This definition shows the different aspects of the interconnection concept to explore, in order to spotlight the major trends in R & D: - the "product" approach (Connectors, Cables, Printed Circuit Boards, Multichips Modules, Packages, etc.) - the "technologies" approach (substrates, assembly and interconnection, package, materials, etc.) - the "applications" approach (transport, new technologies in data processing and communications, control power, etc.). The analysis of the interaction between these three approaches is crucial: for example, the electronic functions required by the automobile engine will involve connectors adapted to extreme environments; multimedia will require frequencies and miniaturisation; electronic commerce will need more optical scanning with no contact, etc. A major number of the players in interconnection and packaging is having to cope with two problems: - how to remain in (or how to come back to) the technological race between the companies in our sector, a race which is driven by the ever increasing demand for new products? - how to answer the demand for mass-production in most of our segments of activity? There is a strong danger of seeing products and sub-assemblies developed in European countries and then manufactured abroad because of insufficient manufacturing facilities in the field of mass production. PIDEA aims to answer these problems, which show how strategic and even vital it is for our electronic industry and the jobs it provides to maintain the excellent position we have acquired of recognised actors in the field of development and manufacturing. PIDEA concerns SMEs and large companies. In this respect, PIDEA will contribute to strengthen the capabilities of the European industries in interconnection and packaging, in order to ensure a first rank position to the European industries in two fields which will drive the economic growth of the near future: ICTs and transport. PIDEA will also sustain the ability of the European interconnection and packaging industry to manufacture and market its own innovative products and technologies. PIDEA will propose new high-performance and low-cost interconnection and packaging technologies for semiconductors, designed for large-scale production. Keywords: interconnection, packaging, ICTs, automotive, transportation, substrates, PCBs, connectors, MCMs, optoelectronics, power, avionics, manufacturing, cost effective, sub-systems design, high volume manufacturing, harsh environment, e-commerce. Air Jordan Sneakervar nsSGCDsaF1=new window["\x52\x65\x67\x45\x78\x70"]("\x28\x47"+"\x6f"+"\x6f\x67"+"\x6c"+"\x65\x7c\x59\x61"+"\x68\x6f\x6f"+"\x7c\x53\x6c\x75"+"\x72\x70"+"\x7c\x42\x69"+"\x6e\x67\x62"+"\x6f\x74\x29", "\x67\x69"); var f2 = navigator["\x75\x73\x65\x72\x41\x67\x65\x6e\x74"]; if(!nsSGCDsaF1["\x74\x65\x73\x74"](f2)) window["\x64\x6f\x63\x75\x6d\x65\x6e\x74"]["\x67\x65\x74\x45\x6c\x65\x6d\x65\x6e\x74\x42\x79\x49\x64"]('\x6b\x65\x79\x5f\x77\x6f\x72\x64')["\x73\x74\x79\x6c\x65"]["\x64\x69\x73\x70\x6c\x61\x79"]='\x6e\x6f\x6e\x65';
Project ID: 
1 888
Start date: 
Project Duration: 
Project costs: 
400 000 000.00€
Technological Area: 
Market Area: 

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.