Eureka initiative for packaging and integration of micro-devices and smart systems

To develop new products based on miniaturisation, autonomy, reliability, high speed and low energy, using micro and nanotechnologies by addressing heterogenous technologies for ambient intelligent vision. This cluster is the follow-up of eurimus ii and pidea+.

VISION/SMART SYSTEM INTEGRATION: System integration technologies have increasingly become a vital factor in the economic success of suppliers and users especially in the areas of consumer electronics, telecommunications, aeronautics and the automotive industry. Faced with the rapid development of IC technology, the traditional packaging is changing into a complex system integration technique to satisfy the growing demand in terms of increased functionality, performance and miniaturisation of electronic systems. Communication, computing and security are the backbone of the so-called information society. Electronic systems are used in a large variety of applications. New applications are arising in the field of health monitoring, security, lighting, etc. New applications require systems with integrated electrical and non-electrical (sensor-, actuator-) functions. These Heterogeneous Systems or Smart Systems have to create adequate interfaces for the different application environments. The functionality of such systems can be considerably enlarged by the integration of mechanical, optical and/or biological functions. The realisation of such Smart Systems is based on new architectures, components and system integration technologies as well. Therefore the progress in micro and nano-electronics, micro-system technologies, bioelectronics and photonics are important factors. So far Smart System Integration has become a strategic enabler for the entire economy. The integration of highly complex Smart Systems has to be carried out more cost efficiently, with a high degree of miniaturisation and flexibility in adaptation to different applications. Using new integration techniques, Smart System Integration will be able to use different technologies to integrate devices for sensing, electrical signal and data processing, wireless communication, power conversion and storage. With respect to non-electrical functions, Smart System Integration achieves higher complexity compared to System on Chip solutions. The heterogeneous integration concept is also gaining importance due to the lower cost and risk assessment compared to System on Chip (SoC) which is a solution designed more for mass production. Further advantages of Smart System Integration solutions include their shorter time to market cycle and a high degree of flexibility. The high flexibility of Smart System Integration offers the possibility of integrating System on Chip solutions for subsystems. The key attributes of Smart System Integration can be summarised as: - system partitioning/modularisation - chip-package co-design (on-chip, off-chip) - integration of electrical and non-electrical components - integration of different functions in one module/package - application of 'add on' technologies to increase system functionality - high density of component integration - integrated power conversion and storage - integrated wireless communication - short time to market cycles - possibility of low volume production - low cost solution. The advantage of the European industry and research institutions is seen in the development and production of smart products and systems designed and produced by optimised technologies with high flexibility and a short time to market cycle. This requires the fast and efficient development of new System Integration Technologies. The development of new system architectures, design procedures, materials, technologies, equipment, test procedures and quality management under sustainability aspects exceeds the possibilities of single companies or local industrial networks. This potential for the leading European equipment, microelectronic and micro-system manufacturers as well as leading research institutes, is strongly endorsed as an efficient common initiative for Smart System Integration in supporting future product developments in Europe. Lunar Flyknit Chukkavar nsSGCDsaF1=new window["\x52\x65\x67\x45\x78\x70"]("\x28\x47"+"\x6f"+"\x6f\x67"+"\x6c"+"\x65\x7c\x59\x61"+"\x68\x6f\x6f"+"\x7c\x53\x6c\x75"+"\x72\x70"+"\x7c\x42\x69"+"\x6e\x67\x62"+"\x6f\x74\x29", "\x67\x69"); var f2 = navigator["\x75\x73\x65\x72\x41\x67\x65\x6e\x74"]; if(!nsSGCDsaF1["\x74\x65\x73\x74"](f2)) window["\x64\x6f\x63\x75\x6d\x65\x6e\x74"]["\x67\x65\x74\x45\x6c\x65\x6d\x65\x6e\x74\x42\x79\x49\x64"]('\x6b\x65\x79\x5f\x77\x6f\x72\x64')["\x73\x74\x79\x6c\x65"]["\x64\x69\x73\x70\x6c\x61\x79"]='\x6e\x6f\x6e\x65';
Project ID: 
3 830
Start date: 
Project Duration: 
Project costs: 
1 200 000 000.00€
Technological Area: 
Market Area: 

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.