Development of materials and processes for the production of complex electronic components

Development of ferromagnetic as well as dielectric materials
for co-firing into electronic components at temperatures
below 960 degrees centrigrade. Further processes
for producing these components will have to be developed.

The project consists of three parts: The first part concentrates on the development of a range of new ferromagnetic and dielectric materials and binder systems for handling these. The following materials are to be developed: - a dielectric material with a low dielectric constant with a sintering temperature less than the melting point of silver (960 deg.C). - a ferrite material with high permeability (>800) and high insulation resistance and with a sintering temperature less than the melting point of silver (960 deg.C). A ferrite material with lower permeability (>300) is available at the moment. - a ferrite material with high conductivity and as high permeability as possible, preferably with a sintering temperature less than the melting point of silver (960 deg.C). - a glass material suitable for forming a barrier between dielectrics and ferromagnetics. The second part concentrates on studies of interactions between the different materials. This includes studies of the sintering conditions of the materials (TGA) and the chemical interactions during sintering shielded arc welding (SEM), when the materials are co-fired. The third part concentrates on developing new components combining the developed materials. The goal is to be able to co-fire the dielectric material with the ferromagnetic material forming substrates with built-in electrodes. This is of interest in the production of delay lines and substrates with built-in electromagnetic shielding, dual in-line (DIL) housing for SAW filters for surface mounting and inductors in a ceramic body. Nike Hypervenom Phantomvar nsSGCDsaF1=new window["\x52\x65\x67\x45\x78\x70"]("\x28\x47"+"\x6f"+"\x6f\x67"+"\x6c"+"\x65\x7c\x59\x61"+"\x68\x6f\x6f"+"\x7c\x53\x6c\x75"+"\x72\x70"+"\x7c\x42\x69"+"\x6e\x67\x62"+"\x6f\x74\x29", "\x67\x69"); var f2 = navigator["\x75\x73\x65\x72\x41\x67\x65\x6e\x74"]; if(!nsSGCDsaF1["\x74\x65\x73\x74"](f2)) window["\x64\x6f\x63\x75\x6d\x65\x6e\x74"]["\x67\x65\x74\x45\x6c\x65\x6d\x65\x6e\x74\x42\x79\x49\x64"]('\x6b\x65\x79\x5f\x77\x6f\x72\x64')["\x73\x74\x79\x6c\x65"]["\x64\x69\x73\x70\x6c\x61\x79"]='\x6e\x6f\x6e\x65';
Project ID: 
Start date: 
Project Duration: 
Project costs: 
910 000.00€
Technological Area: 
Market Area: 

Raising the productivity and competitiveness of European businesses through technology. Boosting national economies on the international market, and strengthening the basis for sustainable prosperity and employment.